Assignment of Assignor's Interest

Recorded: 2011-12-19 Pages: 3

Assignors

JUSKEY, FRANK J.

Executed: 2011-10-04

BANTZ, PAUL

Executed: 2011-10-05

BERGER, OTTO

Executed: 2011-10-04

Assignee

TRIQUINT SEMICONDUCTOR, INC.

2300 NE BROOKWOOD PARKWAY, HILLSBORO, OREGON, 97124

Covered Property (1)

Sheet-Molded Chip-Scale Package

Patent: 8,487,435 →

Application: 13/252,083 →

Publication: US 2012/0080768

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.