Patent Assignment
Reel/Frame 027428/0263
Assignment of Assignor's Interest
Recorded: 2011-12-21
Pages: 3
Assignors
KIM, JONG HAN
Executed: 2011-10-25
JEONG, HYUN CHUL
Executed: 2011-10-25
PARK, JAE MAN
Executed: 2011-10-25
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Ceramic Electronic Component Having an Average Surface Roughness to Provide Adhesion Strength Between a Dielectric Layer and Inner Electrode and Fabrication Method Thereof