IP Library Assignment 027428/0452
Patent Assignment
Reel/Frame 027428/0452

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2011-12-21 Received: 2011-12-21 Pages: 4
Assignors
KU, JAE HUN
Executed: 2011-12-13
CHOI, WON KYOUNG
Executed: 2011-12-20
YONG, CHANG BUM
Executed: 2011-12-20
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
Semiconductor Device and Method of Forming Insulating Layer in Notches Around Conductive TSV for Stress Relief
App. No. 13/333,395