IP Library › Granted Patent US 8,742,591
Granted Patent Utility
US 8,742,591 · Confirmation No. 1063

Semiconductor Device and Method of Forming Insulating Layer in Notches Around Conductive TSV for Stress Relief

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Quick Facts
Patent No.
US 8,742,591
App. No.
13/333,395
Filed
2011-12-21
Granted
2014-06-03
Pub. No.
US20130161824A1
Art Unit
2811
PTA
-13 days