IP Library › Assignment 051285/0318

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Semiconductor Device and Method of Forming Stepped Interconnect Layer for Stacked Semiconductor Die

App. No. 14/612,075

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING CONDUCTIVE VIAS THROUGH INTERCONNECT STRUCTURES AND ENCAPSULANT OF WLCSP

App. No. 14/566,870

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Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP

App. No. 14/564,427

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Semiconductor Device and Method of Forming Patterned Repassivation Openings Between RDL and UBM to Reduce Adverse Effects of Electro-Migration

App. No. 14/563,448

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Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die

App. No. 14/553,358

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Semiconductor Device and Method of Forming Wire Bondable Fan-Out EWLB Package

App. No. 14/548,064

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Semiconductor Device and Method for Forming Openings and Trenches in Insulating Layer by First LDA and Second LDA for RDL Formation

App. No. 14/512,614

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTERCONNECT STRUCTURE OVER SEED LAYER ON CONTACT PAD OF SEMICONDUCTOR DIE WITHOUT UNDERCUTTING SEED LAYER BENEATH INTERCONNECT STRUCTURE

App. No. 14/503,698

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SEMICONDUCTOR DEVICE AND METHOD OF USING LEADFRAME BODIES TO FORM OPENINGS THROUGH ENCAPSULANT FOR VERTICAL INTERCONNECT OF SEMICONDUCTOR DIE

App. No. 14/466,923

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Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant

App. No. 14/462,347

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SEMICONDUCTOR DEVICE AND METHOD OF MAKING WAFER LEVEL CHIP SCALE PACKAGE

App. No. 14/449,914

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING ADHESIVE MATERIAL TO SECURE SEMICONDUCTOR DIE TO CARRIER IN WLCSP

App. No. 14/340,187

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Semiconductor Device and Method of Forming Shielding Layer Over Semiconductor Die Mounted to TSV Interposer

App. No. 14/331,050

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Semiconductor Device and Method of Forming Bump Structure with Insulating Buffer Layer to Reduce Stress on Semiconductor Wafer

App. No. 14/328,922

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Semiconductor Device and Method of Forming TMV and TSV in WLCSP Using Same Carrier

App. No. 14/326,237

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Semiconductor Device Including RDL Along Sloped Side Surface of Semiconductor Die for Z-Direction Interconnect

App. No. 14/292,925

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING UBM STRUCTURE ON BACK SURFACE OF TSV SEMICONDUCTOR WAFER

App. No. 14/288,589

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Semiconductor Device and Method of Forming an Inductor on Polymer Matrix Composite Substrate

App. No. 14/289,344

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Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die

App. No. 14/284,752

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSED OVER THE SEMICONDUCTOR DIE FOR STRESS RELIEF

App. No. 14/274,599

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Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP

App. No. 14/267,800

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SEMICONDUCTOR DEVICE AND METHOD OF EMBEDDING BUMPS FORMED ON SEMICONDUCTOR DIE INTO PENETRABLE ADHESIVE LAYER TO REDUCE DIE SHIFTING DURING ENCAPSULATION

App. No. 14/265,782

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Semiconductor Device and Method of Stacking Semiconductor Die on a Fan-Out WLCSP

App. No. 14/261,252

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Semiconductor Device and Method of Forming Insulating Layer in Notches Around Conductive TSV for Stress Relief

App. No. 14/257,850

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING CONDUCTIVE VIAS USING BACKSIDE VIA REVEAL AND SELECTIVE PASSIVATION

App. No. 14/222,547

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Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die

App. No. 14/194,691

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Semiconductor Device and Method of Forming Ultra High Density Embedded Semiconductor Die Package

App. No. 14/187,014

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Semiconductor Device and Method of Making Embedded Wafer Level Chip Scale Packages

App. No. 14/139,312

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SEMICONDUCTOR DEVICE AND METHOD OF WAFER THINNING INVOLVING EDGE TRIMMING AND CMP

App. No. 14/134,907

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Semiconductor Device and Method of Reducing Warpage Using a Silicon to Encapsulant Ratio

App. No. 14/109,313

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SEMICONDUCTOR DEVICE INCLUDING INTEGRATED PASSIVE DEVICE FORMED OVER SEMICONDUCTOR DIE WITH CONDUCTIVE BRIDGE AND FAN-OUT REDISTRIBUTION LAYER

App. No. 14/092,304

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Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants

App. No. 14/080,609

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Semiconductor Device and Method of Forming Thick Encapsulant for Stiffness with Recesses for Stress Relief in FO-WLCSP

App. No. 14/079,273

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Semiconductor Device and Method of Forming Vertical Interconnect Structure with Conductive Micro Via Array for 3-D FO-WLCSP

App. No. 14/043,751

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INTEGRATED CIRCUIT SYSTEM WITH DEBONDING ADHESIVE AND METHOD OF MANUFACTURE THEREOF

App. No. 14/038,275

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Semiconductor Device and Method of Forming Dual Fan-Out Semiconductor Package

App. No. 14/035,726

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Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure

App. No. 14/021,056

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING CAVITY ADJACENT TO SENSITIVE REGION OF SEMICONDUCTOR DIE USING WAFER-LEVEL UNDERFILL MATERIAL

App. No. 14/021,206

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SEMICONDUCTOR DEVICE HAVING BALANCED BAND-PASS FILTER IMPLEMENTED WITH LC RESONATORS

App. No. 14/018,282

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Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation

App. No. 14/017,963

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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOF

App. No. 13/966,259

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING THROUGH MOLD HOLE WITH ALIGNMENT AND DIMENSION CONTROL

App. No. 13/950,122

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Semiconductor Die and Method of Forming FO-WLCSP Vertical Interconnect Using TSV and TMV

App. No. 13/943,735

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING OPEN CAVITY IN TSV INTERPOSER TO CONTAIN SEMICONDUCTOR DIE IN WLCSMP

App. No. 13/943,737

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Semiconductor Device and Method of Forming Guard Ring Around Conductive TSV Through Semiconductor Wafer

App. No. 13/939,044

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Semiconductor Device and Method of Forming Reconstituted Wafer with Larger Carrier to Achieve More EWLB Packages per Wafer with Encapsulant Deposited Under Temperature and Pressure

App. No. 13/937,952

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING PENETRABLE FILM ENCAPSULANT AROUND SEMICONDUCTOR DIE AND INTERCONNECT STRUCTURE

App. No. 13/937,849

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Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant

App. No. 13/935,963

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING TSV SEMICONDUCTOR WAFER WITH EMBEDDED SEMICONDUCTOR DIE

App. No. 13/936,099

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Semiconductor Device and Method of Forming a Thin Wafer Without a Carrier

App. No. 13/933,406

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SEMICONDUCTOR DEVICE AND METHOD OF MAKING AN EMBEDDED WAFER LEVEL BALL GRID ARRAY (EWLB) PACKAGE ON PACKAGE (POP) DEVICE WITH A SLOTTED METAL CARRIER INTERPOSER

App. No. 13/918,103

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Semiconductor Device and Method of Forming Interposer and Opposing Build-Up Interconnect Structure with Connecting Conductive TMV for Electrical Interconnect of FO-WLCSP

App. No. 13/887,180

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PACKAGE-IN-PACKAGE USING THROUGH-HOLE VIA DIE ON SAW STREETS

App. No. 13/845,409

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Semiconductor Device and Method of Forming Bond-on-Lead Interconnection for Mounting Semiconductor Die in FO-WLCSP

App. No. 13/845,542

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Semiconductor Device and Method of Forming a Shielding Layer Over a Semiconductor Die After Forming a Build-up Interconnect Structure

App. No. 13/845,329

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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE UNDERFILL AND METHOD OF MANUFACTURE THEREOF

App. No. 13/844,160

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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF

App. No. 13/842,582

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Semiconductor Device having Wire Studs as Vertical Interconnect in FO-WLP

App. No. 13/832,781

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SEMICONDUCTOR DEVICE AND METHOD OF USING PARTIAL WAFER SINGULATION FOR IMPROVED WAFER LEVEL EMBEDDED SYSTEM IN PACKAGE

App. No. 13/801,675

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SEMICONDUCTOR DEVICE AND METHOD OF USING SUBSTRATE HAVING BASE AND CONDUCTIVE POSTS TO FORM VERTICAL INTERCONNECT STRUCTURE IN EMBEDDED DIE PACKAGE

App. No. 13/800,807

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Semiconductor Device and Method of Forming RDL Using UV-Cured Conductive Ink Over Wafer Level Package

App. No. 13/795,679

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSED OVER THE SEMICONDUCTOR DIE FOR STRESS RELIEF

App. No. 13/782,618

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Integrated Passive Devices

App. No. 13/782,939

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SEMICONDUCTOR DEVICE AND METHOD FOR FORMING A LOW PROFILE EMBEDDED WAFER LEVEL BALL GRID ARRAY MOLDED LASER PACKAGE (EWLB-MLP)

App. No. 13/772,683

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LEADFRAME INTERPOSER OVER SEMICONDUCTOR DIE AND TSV SUBSTRATE FOR VERTICAL ELECTRICAL INTERCONNECT

App. No. 13/766,646

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Method of Forming Top Electrode for Capacitor and Interconnection in Integrated Passive Device (IPD)

App. No. 13/765,478

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING STRESS RELIEVING VIAS FOR IMPROVED FAN-OUT WLCSP PACKAGE

App. No. 13/759,911

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Semiconductor Device and Method of Forming Through-Silicon-Via with Sacrificial Layer

App. No. 13/743,054

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Semiconductor Device and Method of Forming EWLB Package Containing Stacked Semiconductor Die Electrically Connected through Conductive Vias Formed in Encapsulant Around Die

App. No. 13/732,150

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Semiconductor Device and Method of Forming Directional RF Coupler with IPD for Additional RF Signal Processing

App. No. 13/716,799

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Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect

App. No. 13/715,424

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING PREFABRICATED MULTI-DIE LEADFRAME FOR ELECTRICAL INTERCONNECT OF STACKED SEMICONDUCTOR DIE

App. No. 13/691,464

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Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die

App. No. 13/691,440

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING CONDUCTIVE POSTS AND HEAT SINK OVER SEMICONDUCTOR DIE USING LEADFRAME

App. No. 13/683,946

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING DIFFERENT HEIGHT CONDUCTIVE PILLARS TO ELECTRICALLY INTERCONNECT STACKED LATERALLY OFFSET SEMICONDUCTOR DIE

App. No. 13/684,055

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING CONDUCTIVE POSTS EMBEDDED IN PHOTOSENSITIVE ENCAPSULANT

App. No. 13/683,884

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING FO-WLCSP HAVING CONDUCTIVE LAYERS AND CONDUCTIVE VIAS SEPARATED BY POLYMER LAYERS

App. No. 13/679,792

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING RF FEM WITH LC FILTER AND IPD FILTER OVER SUBSTRATE

App. No. 13/678,134

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING REPASSIVATION LAYER WITH REDUCED OPENING TO CONTACT PAD OF SEMICONDUCTOR DIE

App. No. 13/664,626

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Semiconductor Device and Method of Forming Conductive Ink Layer as Interconnect Structure Between Semiconductor Packages

App. No. 13/653,242

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING VERTICAL INTERCONNECT IN FO-WLCSP USING LEADFRAME DISPOSED BETWEEN SEMICONDUCTOR DIE

App. No. 13/645,385

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Method of Forming an Inductor on a Semiconductor Wafer

App. No. 13/622,280

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SOLDER BUMP WITH INNER CORE PILLAR IN SEMICONDUCTOR PACKAGE

App. No. 13/621,810

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SEMICONDUCTOR DEVICE WITH SOLDER BUMP FORMED ON HIGH TOPOGRAPHY PLATED CU PADS

App. No. 13/621,804

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Semiconductor Device and Method of Forming FO-WLCSP with Discrete Semiconductor Components Mounted Under and Over Semiconductor Die

App. No. 13/607,204

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Semicinductor Device with Cross-Talk Isolation Using M-CAP

App. No. 13/572,517

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Semiconductor Device and Method of Forming RF Balun having Reduced Capacitive Coupling and High CMRR

App. No. 13/571,068

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Semiconductor Device and Method of Forming WLCSP Structure using Protruded MLP

App. No. 13/570,979

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING SHIELDING LAYER OVER SEMICONDUCTOR DIE MOUNTED TO TSV INTERPOSER

App. No. 13/571,020

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SEMICONDUCTOR DEVICE AND METHOD OF STACKING SEMICONDUCTOR DIE IN MOLD LASER PACKAGE INTERCONNECTED BY BUMPS AND CONDUCTIVE VIAS

App. No. 13/566,872

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Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die

App. No. 13/560,008

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SEMICONDUCTOR DEVICE WITH OPTICAL SENSOR AND METHOD OF FORMING INTERCONNECT STRUCTURE ON FRONT AND BACKSIDE OF THE DEVICE

App. No. 13/555,353

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Semiconductor Wafer Having Through-Hole Vias on Saw Streets with Backside Redistribution Layer

App. No. 13/543,618

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SEMICONDUCTOR DEVICE AND METHOD OF EMBEDDING BUMPS FORMED ON SEMICONDUCTOR DIE INTO PENETRABLE ADHESIVE LAYER TO REDUCE DIE SHIFTING DURING ENCAPSULATION

App. No. 13/536,177

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Semiconductor Device and Method of Forming an Embedded SOP Fan-Out Package

App. No. 13/529,918

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SEMICONDUCTOR DEVICE AND METHOD OF EMBEDDING THERMALLY CONDUCTIVE LAYER IN INTERCONNECT STRUCTURE FOR HEAT DISSIPATION

App. No. 13/492,668

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SEMICONDUCTOR DEVICE AND METHOD OF SINGULATING THIN SEMICONDUCTOR WAFER ON CARRIER ALONG MODIFIED REGION WITHIN NON-ACTIVE REGION FORMED BY IRRADIATING ENERGY

App. No. 13/469,754

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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH POST-PASSIVATION INTERCONNECTION AND INTEGRATION

App. No. 13/456,145

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DUAL MOLDED MULTI-CHIP PACKAGE SYSTEM

App. No. 13/443,067

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SEMICONDUCTOR DEVICE AND METHOD OF FORMING B-STAGE CONDUCTIVE POLYMER OVER CONTACT PADS OF SEMICONDUCTOR DIE IN FO-WLCSP

App. No. 13/438,713

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