Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure
View Patent ↗A semiconductor device has a plurality of bumps formed over a carrier. A semiconductor die is mounted to the carrier between the bumps. A penetrable film encapsulant layer having a base layer, first adhesive layer, and second adhesive layer is placed over the semiconductor die and bumps. The penetrable film encapsulant layer is pressed over the semiconductor die and bumps to embed the semiconductor die and bumps within the first and second adhesive layers. The first adhesive layer and second adhesive layer are separated to remove the base layer and first adhesive layer and leave the second adhesive layer around the semiconductor die and bumps. The bumps are exposed from the second adhesive layer. The carrier is removed. An interconnect structure is formed over the semiconductor die and second adhesive layer. A conductive layer is formed over the second adhesive layer electrically connected to the bumps.
1. A semiconductor device, comprising:
a semiconductor die;
a plurality of bumps disposed adjacent to the semiconductor die; and
a multi-layer film encapsulant including,
(a) a thermo-setting adhesive film layer pressed over the semiconductor die and in contact with the bumps to embed the semiconductor die and a first portion of the bumps,
(b) a ultraviolet B-stage film adhesive layer in contact with a first surface of the thermo-setting adhesive film layer with a second portion of the bumps extending into the ultraviolet B-stage film adhesive layer, and
(c) a base layer in contact with a surface of the ultraviolet B-stage film adhesive layer opposite the thermo-setting adhesive film layer.
2. The semiconductor device of claim 1 , wherein a second surface of the thermo-setting adhesive film layer opposite the first surface of the thermo-setting adhesive film layer is coplanar with a surface of the semiconductor die.
3. A semiconductor device, comprising:
a semiconductor die;
a first interconnect structure disposed adjacent to the semiconductor die; and
a multi-layer film encapsulant including,
(a) a thermo-setting adhesive film layer disposed over the semiconductor die and first interconnect structure to embed the semiconductor die and a first portion of the first interconnect structure,
(b) a ultraviolet B-stage film adhesive layer in contact with a first surface of the thermo-setting adhesive film layer with a second portion of the first interconnect structure extending into the ultraviolet B-stage film adhesive layer, and
(c) a base layer in contact with a surface of the ultraviolet B-stage film adhesive layer opposite the thermo-setting adhesive film layer.
4. The semiconductor device of claim 3 , wherein the first interconnect structure includes a bump or a conductive pillar.
5. The semiconductor device of claim 3 , wherein a second surface of the thermo-setting adhesive film layer opposite the first surface of the thermo- setting adhesive film layer is coplanar with a surface of the semiconductor die.
6. A semiconductor device, comprising:
a semiconductor die;
a first interconnect structure disposed adjacent to the semiconductor die; and
a multi-layer film encapsulant including,
(a) a penetrable film layer disposed over the semiconductor die and first interconnect structure to embed the semiconductor die and a first portion of first interconnect structure, the penetrable film layer coplanar with a first and second surface of the semiconductor die,
(b) a film adhesive layer in contact with a surface of the penetrable film layer with a second portion of the first interconnect structure extending into the film adhesive layer, and
(c) a base layer in contact with a surface of the film adhesive layer opposite the penetrable film layer.
7. The semiconductor device of claim 6 , wherein the first interconnect structure includes a bump or a conductive pillars.
8. A semiconductor device, comprising:
a semiconductor die;
a first interconnect structure disposed adjacent to the semiconductor die; and
a multi-layer film encapsulant including,
(a) a penetrable film layer pressed over the semiconductor die and first interconnect structure to embed the semiconductor die and a first portion of the first interconnect structure,
(b) a film adhesive layer in contact with a surface of the penetrable film layer with a second portion of the first interconnect structure extending into the film adhesive layer, and
(c) a base layer in contact with a surface of the film adhesive layer opposite the penetrable film layer.
9. The semiconductor device of claim 8 , wherein the first interconnect structure includes a bump or a conductive pillar.