Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy
View Patent ↗A semiconductor device comprises a carrier including an adhesive disposed over the carrier. The semiconductor device further comprises a semiconductor wafer including a plurality of semiconductor die separated by a non-active region. A plurality of bumps is formed over the semiconductor die. The semiconductor wafer is mounted to the carrier with the adhesive disposed around the plurality of bumps. Irradiated energy is applied to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. The semiconductor wafer is singulated along the modified region by applying stress to the semiconductor wafer. The adhesive is removed from around the plurality of bumps after singulating the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die comprising through silicon vias. The modified region optionally includes a plurality of vertically stacked modified regions.
1. A method of making a semiconductor device, comprising:
providing a carrier including an adhesive disposed over the carrier;
providing a semiconductor wafer including a plurality of semiconductor die separated by a non-active region;
forming a plurality of bumps over the semiconductor die;
disposing the semiconductor wafer over the carrier to embed the bumps in the adhesive with the adhesive extending to the semiconductor wafer;
applying irradiated energy to the non-active region to form a modified region within the non-active region;
singulating the semiconductor wafer along the modified region by,
disposing a heating element over a first surface of the semiconductor wafer, and
disposing a cooling element over a second surface of the semiconductor wafer opposite the first surface;
removing the bumps from the adhesive after singulating the semiconductor wafer; and
depositing an encapsulant over the plurality of semiconductor die after removing the bumps from the adhesive.
2. The method of claim 1 , wherein singulating the semiconductor wafer along the modified region further includes applying stress to the semiconductor wafer by applying a temperature gradient across the semiconductor wafer using the heating element and cooling element.
3. The method of claim 1 , wherein singulating the semiconductor wafer along the modified region includes applying mechanical stress to the semiconductor wafer.
4. The method of claim 1 , further including removing a portion of the semiconductor wafer to thin the semiconductor wafer.
5. The method of claim 1 , further including warming the adhesive before removing the bumps from the adhesive.
6. The method of claim 1 , further including mounting a tape to the semiconductor wafer opposite the adhesive before removing the bumps from the adhesive.
7. The method of claim 1 , further including providing the semiconductor wafer as a plurality of semiconductor die comprising through silicon vias.
8. The method of claim 1 , wherein the semiconductor die include a polygon shape with three or more sides.
9. A method of making a semiconductor device, comprising:
providing a carrier including an adhesive disposed over the carrier;
disposing a semiconductor wafer comprising bumps over the carrier to embed the bumps in the adhesive with the adhesive extending to the semiconductor wafer;
applying irradiated energy to a non-active region of the semiconductor wafer to form a modified region;
singulating the semiconductor wafer into a plurality of semiconductor die by applying a temperature gradient across the semiconductor wafer to produce stress along the modified region while the bumps remain embedded in the adhesive wherein applying the temperature gradient across the semiconductor wafer includes, disposing a heating element over a first surface of the semiconductor wafer, and disposing a cooling element over a second surface of the semiconductor wafer opposite the first surface;
removing the bumps from the adhesive after singulating the semiconductor wafer; and
depositing an encapsulant over the plurality of semiconductor die after removing the bumps from the adhesive.
10. The method of claim 9 , wherein singulating the semiconductor wafer along the modified region includes applying mechanical stress to the semiconductor wafer.
11. The method of claim 9 , further including mounting a tape to the semiconductor wafer opposite the adhesive before removing the bumps from the adhesive.
12. The method of claim 9 , further including forming the modified region as a plurality of vertically stacked modified regions.
13. The method of claim 9 , further including providing the semiconductor wafer as a plurality of semiconductor die comprising through silicon vias.
14. The method of claim 9 , further including removing a portion of the semiconductor wafer to thin the semiconductor wafer.