IP Library Granted Patent US 9,184,139
Granted Patent Utility
US 9,184,139 · Confirmation No. 7114

Semiconductor Device and Method of Reducing Warpage Using a Silicon to Encapsulant Ratio

Applicant: STATS ChipPAC, Ltd.
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2015-10-21 ISSUE.NTF Issue Notification 1 View
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2015-10-08 WFEE Fee Worksheet (SB06) 2 View
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2015-07-17 NOA Notice of Allowance and Fees Due (PTOL-85) 8 View
2015-07-17 892 List of references cited by examiner 1 View
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2015-07-17 1449 List of References cited by applicant and considered by examiner 4 View
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2015-07-17 BIB Bibliographic Data Sheet 1 View
2015-07-17 SRNT Examiner's search strategy and results 3 View
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2015-07-17 IIFW Issue Information including classification, examiner, name, claim, renumbering, etc. 3 View
2015-06-25 ELC. Response to Election / Restriction Filed 8 View
2015-06-25 CLM Claims 5 View
2015-06-25 N417 Electronic Filing System Acknowledgment Receipt 2 View
2015-06-25 WFEE Fee Worksheet (SB06) 1 View
2015-06-18 NTC.PUB Notice of Publication 1 View
2015-05-01 CTRS Requirement for Restriction/Election 6 View
2015-05-01 FWCLM Index of Claims 1 View
2014-01-07 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2014-01-07 APP.FILE.REC Filing Receipt 3 View
2013-12-18 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
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2013-12-17 SPEC Specification 44 View
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Quick Facts
Patent No.
US 9,184,139
App. No.
14/109,313
Filed
2013-12-17
Granted
2015-11-10
Pub. No.
US20150171024A1
Examiner
THAI, DAVIS
Art Unit
2891
PTA
0 days