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Patent Assignment
Reel/Frame 031802/0649

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2013-12-17 Received: 2013-12-17 Pages: 4
Assignors
CHOI, WON KYOUNG
Executed: 2013-12-16
MARIMUTHU, PANDI C.
Executed: 2013-12-16
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Applications (2)
Semiconductor Device and Method of Reducing Warpage Using a Silicon to Encapsulant Ratio
App. No. 14/109,313
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VEHICLE-WHEEL FRONT FACE
App. No. 29/476,821
→