Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device
A semiconductor device includes a carrier and semiconductor die having an optically active region. The semiconductor die is mounted to the carrier to form a separation between the carrier and the semiconductor die. The semiconductor device further includes a passivation layer disposed over a surface of the semiconductor die and a glass layer disposed over a surface of the passivation layer. The passivation layer has a clear portion for passage of light to the optically active region of the semiconductor die. The semiconductor device further includes an encapsulant disposed over the carrier within the separation to form an expansion region around a periphery of the semiconductor die, a first via penetrating the expansion region, glass layer, and passivation layer, a second via penetrating the glass layer and passivation layer to expose a contact pad on the semiconductor die, and a conductive material filling the first and second vias.
1. A method of making a semiconductor device, comprising:
providing a semiconductor die;
providing an insulating layer in contact with an active surface of the semiconductor die;
disposing a substrate over the semiconductor die and insulating layer;
depositing an encapsulant to surround the semiconductor die;
removing the substrate after depositing the encapsulant;
forming an opening in the insulating layer extending to the semiconductor die using a laser; and
forming a first conductive material within the opening and electrically connected to the semiconductor die.
2. The method of claim 1 , further including:
forming a via through the encapsulant using the laser; and
forming a second conductive material within the via.
3. The method of claim 1 , further including forming a conductive layer over the insulating layer and electrically connected to the semiconductor die.
4. The method of claim 1 , further including forming an interconnect structure over the semiconductor die and encapsulant.
5. The method of claim 4 , wherein forming the interconnect structure includes forming a plurality of bumps.
6. The method of claim 1 , wherein the active surface of the semiconductor die includes an optically active region.
7. A method of making a semiconductor device, comprising:
providing a wafer;
singulating a semiconductor die from the wafer;
disposing the semiconductor die over a temporary carrier;
forming an insulating layer on an active surface of the semiconductor die;
depositing an insulating material around the semiconductor die after singulating the semiconductor die from the wafer;
removing the temporary carrier;
forming an opening in the insulating layer extending to a contact pad of the semiconductor die using a laser; and
forming an interconnect structure over the semiconductor die at least partially within the opening of the insulating layer after removing the temporary carrier.
8. The method of claim 7 , further including:
forming a via through the insulating material using the laser; and
forming a second conductive material within the via.
9. The method of claim 7 , further including:
forming a via through the semiconductor die using the laser; and
forming a second conductive material within the via.
10. The method of claim 7 , wherein forming the interconnect structure includes forming a conductive layer over the insulating layer and electrically connected to the semiconductor die.
11. The method of claim 7 , wherein forming the interconnect structure includes forming a plurality of bumps.
12. The method of claim 7 , wherein the active surface of the semiconductor die includes an optically active region.
13. The method of claim 7 , wherein the insulating layer includes a clear material.
14. The method of claim 7 , wherein depositing the insulating material over the semiconductor die further includes depositing the insulating material across a back surface of the semiconductor die continuously from a first side of the semiconductor die to a second side of the semiconductor die opposite the first side.
15. A method of making a semiconductor device, comprising:
providing a semiconductor die;
disposing the semiconductor die over a carrier;
forming an insulating layer over an active surface of the semiconductor die;
depositing an insulating material continuously across a back surface of the semiconductor die;
removing the carrier;
forming an opening in the insulating layer extending to the semiconductor die using a laser; and
forming an interconnect structure over the semiconductor die after removing the carrier.
16. The method of claim 15 , further including:
forming a via through the insulating material using the laser; and
forming a second conductive material within the via.
17. The method of claim 15 , wherein forming the interconnect structure includes forming a conductive layer over the insulating layer and electrically connected to the semiconductor die.
18. The method of claim 15 , further including:
forming a via through the semiconductor die using the laser; and
forming a second conductive material within the via.
19. The method of claim 15 , wherein providing the semiconductor die further includes:
providing a wafer including a plurality of semiconductor die; and
singulating the semiconductor die from the wafer.
20. The method of claim 19 , wherein depositing the insulating material around the semiconductor die further includes depositing the insulating material around the semiconductor die after singulating the semiconductor die from the wafer.
21. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming an insulating layer over the semiconductor die;
depositing an encapsulant continuously across a back surface of the semiconductor die;
forming an opening through the insulating layer extending to a contact pad of the semiconductor die using a laser; and
forming an interconnect structure over the semiconductor die and into the opening of the insulating layer.
22. The method of claim 21 , further including:
forming a via through the encapsulant using the laser; and
forming a second conductive material within the via.
23. The method of claim 21 , wherein forming the interconnect structure includes forming a conductive layer over the insulating layer and electrically connected to the semiconductor die.
24. The method of claim 21 , wherein forming the interconnect structure includes forming a plurality of bumps.
25. The method of claim 21 , wherein the semiconductor die includes an optically active region.