Semiconductor device and method of forming WLCSP structure using protruded MLP
View Patent ↗A semiconductor device can include a carrier substrate, and a first semiconductor die disposed on a surface of the carrier substrate. An encapsulant can be disposed over the first semiconductor die and the carrier substrate. The semiconductor device can include first vias disposed through the encapsulant as well as second vias disposed through the encapsulant to expose first contact pads. The first contact pads are on upper surfaces of the first semiconductor die. The semiconductor device can include conductive pillars that fill the first vias, and first conductive metal vias (CMVs) that fill the second vias. The conductive pillar can include a first conductive material, and the first CMVs can be in contact with the first contact pads. The semiconductor device can include a conductive layer disposed over the encapsulant. The conductive layer can electrically connect one of the first CMVs with one of the conductive pillars.
1. A semiconductor device, comprising:
a substrate;
a first semiconductor die disposed over the substrate;
an encapsulant deposited over the substrate and over a surface of the first semiconductor die;
a first conductive via formed through the encapsulant and extending beyond a first surface of the encapsulant only partially into the substrate;
a second conductive via formed through the encapsulant over the first semiconductor die; and
a conductive layer formed over the encapsulant between the first conductive via and second conductive via.
2. The semiconductor device of claim 1 , further including an insulating layer formed over the conductive layer and encapsulant.
3. The semiconductor device of claim 1 , further including a seed layer formed over a portion of the first conductive via extending beyond the first surface of the encapsulant.
4. The semiconductor device of claim 1 , further including:
a second semiconductor die disposed over the first semiconductor die; and
a third conductive via formed through the encapsulant and electrically connected to the second semiconductor die.
5. The semiconductor device of claim 1 , wherein the first conductive via extends beyond a second surface of the encapsulant opposite the first surface of the encapsulant.
6. The semiconductor device of claim 1 , further including a plurality of stacked semiconductor devices electrically connected through the first conductive via.
7. A semiconductor device, comprising:
a first semiconductor die;
an encapsulant deposited around the first semiconductor die and over a surface of the first semiconductor die;
a first conductive via formed through the encapsulant and extending beyond a first surface of the encapsulant to expose a side surface of the first conductive via; and
a second conductive via formed through the encapsulant over the first semiconductor die.
8. The semiconductor device of claim 7 , further including a conductive layer formed over the encapsulant between the first conductive via and second conductive via.
9. The semiconductor device of claim 8 , further including an insulating layer formed over the conductive layer and encapsulant.
10. The semiconductor device of claim 7 , wherein the first conductive via further includes a seed layer extending beyond the first surface of the encapsulant.
11. The semiconductor device of claim 7 , further including:
a second semiconductor die disposed over the first semiconductor die; and
a third conductive via formed through the encapsulant and electrically connected to the second semiconductor die.
12. The semiconductor device of claim 7 , wherein the first conductive via extends beyond a second surface of the encapsulant opposite the first surface of the encapsulant.
13. The semiconductor device of claim 7 , further including a plurality of stacked semiconductor devices electrically connected through the first conductive via.
14. A semiconductor device, comprising:
a first semiconductor die;
an encapsulant deposited over the first semiconductor die;
a first conductive via formed through the encapsulant and extending beyond a first surface of the encapsulant to expose a side surface of the first conductive via;
a conductive layer formed over the encapsulant and electrically connected to the first conductive via; and
an insulating layer formed over the conductive layer and encapsulant.
15. The semiconductor device of claim 14 , further including a second conductive via formed through the encapsulant over the first semiconductor die.
16. The semiconductor device of claim 14 , wherein the first conductive via further includes a seed layer extending beyond the first surface of the encapsulant.
17. The semiconductor device of claim 14 , further including:
a second semiconductor die disposed over the first semiconductor die; and
a second conductive via formed through the encapsulant and electrically connected to the second semiconductor die.
18. The semiconductor device of claim 14 , wherein the first conductive via extends beyond a second surface of the encapsulant opposite the first surface of the encapsulant.
19. The semiconductor device of claim 14 , further including a plurality of stacked semiconductor devices electrically connected through the first conductive via.
20. A semiconductor device, comprising:
a first semiconductor die;
an encapsulant deposited around the first semiconductor die and over a surface of the first semiconductor die; and
a first conductive via formed through the encapsulant and extending beyond a first surface of the encapsulant to expose a side surface of the first conductive via.
21. The semiconductor device of claim 20 , further including:
a second conductive via formed through the encapsulant over the first semiconductor die; and
a conductive layer formed over the encapsulant between the first conductive via and second conductive via.
22. The semiconductor device of claim 21 , further including an insulating layer formed over the conductive layer and encapsulant.
23. The semiconductor device of claim 20 , wherein the first conductive via further includes a seed layer extending beyond the first surface of the encapsulant.
24. The semiconductor device of claim 20 , further including:
a second semiconductor die disposed over the first semiconductor die; and
a second conductive via formed through the encapsulant and electrically connected to the second semiconductor die.
25. The semiconductor device of claim 20 , wherein the first conductive via extends beyond a second surface of the encapsulant opposite the first surface of the encapsulant.