Patent Assignment
Reel/Frame 027432/0063
Assignment of Assignor's Interest
Recorded: 2011-12-22
Pages: 3
Assignor
TOMIZAWA, HIDEYUKI
Executed: 2011-12-21
Assignee
TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
19900 MACARTHUR BLVD., SUITE 400, IRVINE, CALIFORNIA, 92612
Covered Property
(1)
Graded Density Layer for Formation of Interconnect Structures
Application:
13/334,257 →
Publication:
US 2013/0161798
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.