Patent Assignment
Reel/Frame 027700/0242
Assignment of Assignor's Interest
Recorded: 2012-02-14
Pages: 5
Assignor
TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Executed: 2012-02-12
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Properties
(18)
Metal Containing Sacrifice Material and Method of Damascene Wiring Formation
Semiconductor Device and Method of Manufacturing the Same
Application:
12/961,762 →
Publication:
US 2012/0139033
Semiconductor Device and Method of Fabricating the Same
Application:
12/961,793 →
Publication:
US 2012/0139057
Methods of Making Fins and Fin Field Effect Transistors (Finfets)
Semiconductor Device and Method of Fabricating the Same
Application:
13/041,732 →
Publication:
US 2012/0228628
Ion Implanted Resist Strip with Superacid
Application:
13/069,625 →
Publication:
US 2012/0244690
Transistor Structure and Manufacturing Method Which Has Channel Epitaxial Equipped with Lateral Epitaxial Structure
Application:
13/070,561 →
Publication:
US 2012/0241866
Self-Aligned Silicide Formation on Source/Drain Through Contact Via
Specific Contact Resistivity Measurement Method, Semiconductor Device for Specific Contact Resistivity Measurement, and Method for Manufacturing the Same
Application:
13/070,704 →
Publication:
US 2012/0242356
Overlay Control Method and a Semiconductor Manufacturing Method and Apparatus Employing the Same
Application:
13/071,956 →
Publication:
US 2012/0244461
Method for Fabrication of Interconnect Structure with Improved Alignment for Semiconductor Devices
Semiconductor Device with Threshold Voltage Control and Method of Fabricating the Same
Application:
13/162,825 →
Publication:
US 2012/0319207
Cryogenic Silicon Ion-Implantation and Recrystallization Annealing
Application:
13/181,935 →
Publication:
US 2013/0017674
Lithography Tool Alignment Control System
Application:
13/268,248 →
Publication:
US 2013/0090877
Formation of Sti Trenches for Limiting Pn-Junction Leakage
Application:
13/293,269 →
Publication:
US 2013/0119506
Graded Density Layer for Formation of Interconnect Structures
Application:
13/334,257 →
Publication:
US 2013/0161798
Systems and Methods for Backside Threshold Voltage Adjustment
Application:
13/338,478 →
Publication:
US 2013/0168823
Methods for Integration of Metal/Dielectric Interconnects
Application:
13/338,486 →
Publication:
US 2013/0171819
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 30, 2010
From: UOZUMI, YOSHIHIRO
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 025433/0351 →
Assignment of Assignor's Interest
Dec 7, 2010
From: GOTO, MASAKAZU
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 025461/0260 →
Assignment of Assignor's Interest
Dec 7, 2010
From: YAMASAKI, HIROYUKI; MIYAJIMA, HIDESHI; UOZUMI, YOSHIHIRO
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 025461/0115 →
Assignment of Assignor's Interest
Jan 28, 2011
From: KAWASAKI, HIROHISA; VEERARAGHAVAN, BASKER; ADHIKARI, HEMANT; MASZARA, WITOLD
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.; GLOBALFOUNDRIES INC.; INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 025712/0827 →
Assignment of Assignor's Interest
Mar 7, 2011
From: ONODA, HIROYUKI; OOTA, HIROYUKI
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 025910/0238 →
Assignment of Assignor's Interest
Mar 23, 2011
From: UOZUMI, YOSHIHIRO
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 026004/0076 →
Assignment of Assignor's Interest
Mar 24, 2011
From: YAMASAKI, HIROYUKI
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 026011/0419 →
Assignment of Assignor's Interest
Mar 25, 2011
From: NAGAI, SATOSHI
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 026022/0873 →
Assignment of Assignor's Interest
Apr 11, 2011
From: NAMA, HITHESH; BUTALA, AMIT; MUKHERJEE, SAUANDEV
To: SPIDERCLOUD WIRELESS, INC.
Reel/Frame 026107/0625 →
Assignment of Assignor's Interest
Apr 14, 2011
From: UOZUMI, YOSHIHIRO
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 026124/0360 →
Assignment of Assignor's Interest
May 27, 2011
From: OHUCHI, KAZUYA; KUSUNOKI, NAOKI
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 026353/0098 →
Assignment of Assignor's Interest
Jun 17, 2011
From: IIJIMA, RYOSUKE
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 026456/0001 →
Assignment of Assignor's Interest
Jul 13, 2011
From: ITOKAWA, HIROSHI
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 026585/0156 →
Assignment of Assignor's Interest
Aug 16, 2011
From: KATO, HIROKAZU
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 026755/0395 →
Assignment of Assignor's Interest
Nov 10, 2011
From: HOKAZONO, AKIRA
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 027206/0217 →
Assignment of Assignor's Interest
Dec 22, 2011
From: TOMIZAWA, HIDEYUKI
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 027432/0063 →
Assignment of Assignor's Interest
Dec 28, 2011
From: MIYAJIMA, HIDESHI; MASUDA, HIDEAKI
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 027451/0784 →
Assignment of Assignor's Interest
Dec 28, 2011
From: IIJIMA, RYOSUKE
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 027451/0730 →
Assignment of Assignor's Interest
Jan 24, 2012
From: NAGAI, SATOSHI
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 027586/0008 →
Corrective Assignment to Correct the Assignees (Globalfoundries Inc. & International Business Machines Corporation) That Were Erroneously and Previously Recorded on Reel 025712 Frame 0827. Assignor(S) Hereby Confirms the Correct Assignee Is Toshiba America Electronic Components, Inc.
Jan 9, 2015
From: KAWASAKI, HIROHISA
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 034747/0699 →
Assignment of Assignor's Interest
Jan 9, 2015
From: ADHIKARI, HEMANT; MASZARA, WITOLD
To: GLOBALFOUNDRIES INC.
Reel/Frame 034672/0813 →
Assignment of Assignor's Interest
Jan 9, 2015
From: VEERARAGHAVAN, BASKER
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 034672/0824 →
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Security Interest
Jun 22, 2016
From: SPIDERCLOUD WIRELESS, INC.; SPIDERCLOUD WIRELESS SERVICES, LLC
To: EASTWARD FUND MANAGEMENT, LLC
Reel/Frame 039120/0719 →