Patent Assignment
Reel/Frame 026755/0395
Assignment of Assignor's Interest
Recorded: 2011-08-16
Pages: 3
Assignor
KATO, HIROKAZU
Executed: 2011-08-04
Assignee
TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
19900 MACARTHUR BOULEVARD, SUITE 400, IRVINE, CALIFORNIA, 92612
Covered Property
(1)
Method for Fabrication of Interconnect Structure with Improved Alignment for Semiconductor Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.