Patent Assignment
Reel/Frame 027438/0967
Assignment of Assignor's Interest
Recorded: 2011-12-23
Pages: 3
Assignor
GUZEK, JOHN S.
Executed: 2010-06-16
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Mold Compounds in Improved Embedded-Die Coreless Substrates, and Processes of Forming Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.