Patent Assignment
Reel/Frame 027451/0109
Assignment of Assignor's Interest
Recorded: 2011-12-28
Pages: 2
Assignors
AOKI, MAYU
Executed: 2011-12-13
TAKEDA, KENICHI
Executed: 2011-12-13
HOZAWA, KAZUYUKI
Executed: 2011-12-13
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device with Silicon Through Electrode and Moisture Barrier