Patent Assignment
Reel/Frame 027453/0352
Assignment of Assignor's Interest
Recorded: 2011-12-28
Pages: 3
Assignee
IBIDEN CO., LTD.
2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Board with Built-in Electronic Component and Method for Manufacturing the Same