IP Library › Assignment 027470/0922
Patent Assignment
Reel/Frame 027470/0922

Assignment of Assignor's Interest

Recorded: 2012-01-03 Pages: 2
Assignors
LANDESBERGER, CHRISTOF
Executed: 2011-10-28
FAUL, ROBERT
Executed: 2011-10-28
Assignee
Covered Property (1)
Method of Producing a Chip Package, and Chip Package
Patent: 8,563,358 →
Application: 13/275,988 →
Publication: US 2012/0091594