Patent Assignment
Reel/Frame 027484/0747
Assignment of Assignor's Interest
Recorded: 2012-01-05
Pages: 3
Assignors
FURUYA, MASAHIRO
Executed: 2011-12-05
TAGAMI, SHOHEI
Executed: 2011-12-05
KATO, HIDETO
Executed: 2011-12-05
ITO, HIDEYUKI
Executed: 2011-12-05
YOSHIZAWA, MASAHIRO
Executed: 2011-12-05
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Temporary Adhesive Composition, and Method of Producing Thin Wafer