Patent Assignment
Reel/Frame 027503/0424
Assignment of Assignor's Interest
Recorded: 2012-01-09
Pages: 5
Assignors
YU, CHEN-HUA
Executed: 2011-12-22
JENG, SHIN-PUU
Executed: 2011-12-22
HOU, SHANG-YUN
Executed: 2011-11-22
HSIEH, CHENG-CHIEH
Executed: 2011-12-22
HSU, KUO-CHING
Executed: 2011-12-22
SHIH, YING-CHING
Executed: 2011-12-22
TSAI, PO-HAO
Executed: 2011-12-22
KAO, CHIN-FU
Executed: 2011-12-22
HUANG, CHENG-LIN
Executed: 2011-12-22
LIN, JING-CHENG
Executed: 2011-12-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Connector Design for Packaging Integrated Circuits