Patent Assignment
Reel/Frame 027533/0644
Assignment of Assignor's Interest
Recorded: 2012-01-13
Pages: 2
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, 108-8001, JAPAN
Covered Property
(1)
Substrate for Semiconductor Package and Method of Manufacturing Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.