Patent Assignment
Reel/Frame 027540/0288
Assignment of Assignor's Interest
Recorded: 2012-01-17
Pages: 2
Assignor
TAGO, MASAMOTO
Executed: 2011-12-06
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device, Mounted Substrate to Be Used in Semiconductor Device, and Manufacturing Method of Mounted Substrate