Patent Assignment
Reel/Frame 027554/0027
Assignment of Assignor's Interest
Recorded: 2012-01-18
Pages: 2
Assignors
CHEN, CHIH-HUA
Executed: 2012-01-11
CHEN, CHEN-SHIEN
Executed: 2012-01-11
HSIAO, CHING-WEN
Executed: 2012-01-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
PoP Structures Including Through-Assembly Via Modules