Patent Assignment
Reel/Frame 027557/0164
Assignment of Assignor's Interest
Recorded: 2012-01-19
Pages: 6
Assignors
APANIUS, CHRISTOPHER
Executed: 2008-01-09
SHICK, ROBERT A.
Executed: 2008-01-04
NG, HENDRA
Executed: 2008-01-03
BELL, ANDREW
Executed: 2008-01-03
ZHANG, WEI
Executed: 2008-01-03
NEAL, PHILLIP S.
Executed: 2008-01-02
Assignee
PROMERUS LLC
9921 BRECKSVILLE ROAD, BUILDING R, BRECKSVILLE, OHIO, 44141
Covered Property
(1)
Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.