Assignment of Assignor's Interest

Recorded: 2014-02-13 Pages: 3

Assignor

PROMERUS, LLC

Executed: 2014-02-13

Assignee

SUMITOMO BAKELITE CO., LTD.

5-8, HIGASHI-SHINAGAWA, 2-CHROME SHINAGAWA-KU, TOKYO, 140-0002, JAPAN

Covered Property (1)

Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding

Patent: 8,816,485 →

Application: 13/352,424 →

Publication: US 2012/0175721

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.