Patent Assignment
Reel/Frame 027560/0062
Assignment of Assignor's Interest
Recorded: 2012-01-19
Pages: 3
Assignors
HIGUMA, SATOSHI
Executed: 2011-12-15
HIROTSURU, HIDEKI
Executed: 2011-12-16
NARITA, SHINYA
Executed: 2011-12-16
Assignee
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO, 103-8338, JAPAN
Covered Property
(1)
Led Chip Assembly, Led Package, and Manufacturing Method of Led Package