Patent Assignment
Reel/Frame 027580/0126
Assignment of Assignor's Interest
Recorded: 2012-01-24
Pages: 2
Assignors
LU, SZU WEI
Executed: 2012-01-12
WANG, YING-DA
Executed: 2012-01-12
KUO, LI-CHUNG
Executed: 2012-01-12
LIN, JING-CHENG
Executed: 2012-01-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Sawing Underfill in Packaging Processes