Assignment of Assignor's Interest

Recorded: 2012-01-25 Pages: 4

Assignors

YUAN, SHAONING

Executed: 2011-11-03

LU, YUE KANG

Executed: 2011-11-05

LIM, YEOW KHENG

Executed: 2011-10-31

TAN, JUAN BOON

Executed: 2011-10-31

Assignee

60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE

Covered Property (1)

Crack-Arresting Structure for Through-Silicon Vias

Patent: 8,860,185 →

Application: 13/357,960 →

Publication: US 2013/0187280

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.