Patent Assignment
Reel/Frame 027603/0550
Assignment of Assignor's Interest
Recorded: 2012-01-26
Pages: 3
Assignors
YIU, HO-YIN
Executed: 2012-01-19
LOU, BAI-YAO
Executed: 2012-01-19
LIU, CHIEN-HUNG
Executed: 2012-01-19
YANG, WEI-CHUNG
Executed: 2012-01-19
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI CITY, TAOYUAN COUNTRY, 32062, TAIWAN
Covered Property
(1)
Power Module and the Method of Packaging the Same