Patent Assignment
Reel/Frame 027607/0917
Assignment of Assignor's Interest
Recorded: 2012-01-27
Pages: 4
Assignee
KANEKA CORPORATION
2-4, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI, OSAKA, 530-8288, JAPAN
Covered Property
(1)
Curable Composition, Heat Conductive Resin Molded Product and Semiconductor Package
Application:
13/296,630 →
Publication:
US 2012/0123054
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.