CURABLE COMPOSITION, HEAT CONDUCTIVE RESIN MOLDED PRODUCT AND SEMICONDUCTOR PACKAGE
A curable resin composition containing: (A) an organic compound containing in a molecule at least two carbon-carbon double-bonds having reactivity with a SiH group; (B) a compound containing in a molecule at least two SiH groups; and (C) a heat-conductive filler, which is at least one species selected from the group consisting of a-alumina, hexagonal boron nitride, aluminum nitride and zinc oxide, and is a particle wherein a primary particle has a number average particle diameter of at least 0.10 μm, wherein heat conductivity after curing is at least 0.8 W/mK.
1 . A curable resin composition containing:
(A) an organic compound containing in a molecule at least two carbon-carbon double-bonds having reactivity with a SiH group;
(B) a compound containing in a molecule at least two SiH groups; and
(C) a heat-conductive filler, which is at least one species selected from the group consisting of a-alumina, hexagonal boron nitride, aluminum nitride and zinc oxide, and is a particle wherein a primary particle has a number average particle diameter of at least 0.10 μm,
wherein heat conductivity after curing is at least 0.8 W/mK.
2 . The curable resin composition according to claim 1 ,
wherein the compound (B) is a compound obtained by a hydrosilylation reaction between an organic compound (B-1) containing in a molecule at least two carbon-carbon double-bonds having reactivity with a SiH group and a silicon compound (B-2) containing at least two SiH groups in a molecule.
3 . The curable resin composition according to claim 2 , wherein the organic compound (B-1) has a heterocyclic skeleton or an alicyclic skeleton.
4 . The curable resin composition according to claim 3 , wherein the organic compound (B-1) is a compound represented by the following general formula (1):
wherein R 1 , R 2 and R 3 all represent organic groups, and at least two of them are alkenyl groups.
5 . The curable resin composition according to claim 1 , wherein the heat-conductive filler (C) is zinc oxide.
6 . The curable resin composition according to claim 5 , wherein the volume ratio of the zinc oxide is 5 to 90% by volume of the whole composition.
7 . The curable resin composition according to claim 1 , further containing a hydrosilylation catalyst (D).
8 . The curable resin composition according to claim 1 , further containing a silica (E).
9 . A heat-conductive resin molded product obtained by a hydrosilylation reaction of the curable resin composition according to claim 1 .
10 . The heat-conductive resin molded product according to claim 9 , which has the initial reflectance at a wavelength of 450 nm of at least 75%.
11 . A package for semiconductor containing the heat-conductive resin molded product according to claim 9 .
12 . The package for semiconductor according to claim 11 , using a light-emitting diode as the semiconductor.