Patent Assignment
Reel/Frame 027674/0066
Assignment of Assignor's Interest
Recorded: 2012-02-08
Pages: 3
Assignor
LIN, CHIA-SHENG
Executed: 2012-02-06
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI CITY, TAOYUAN COUNTRY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Fabrication Method Thereof