Patent Assignment
Reel/Frame 027686/0978
Assignment of Assignor's Interest
Recorded: 2012-02-10
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Post-Passivation Interconnect Structure Amd Method of Forming Same