Patent Assignment
Reel/Frame 027688/0027
Assignment of Assignor's Interest
Recorded: 2012-02-10
Pages: 2
Assignor
KUO, YUNG-HSIN
Executed: 2012-02-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Methods of Improving Bump Allocation for Semiconductor Devices and Semiconductor Devices with Improved Bump Allocation