IP Library Assignment 027690/0118
Patent Assignment
Reel/Frame 027690/0118

Assignment of Assignor's Interest

Recorded: 2012-02-07 Pages: 4
Assignors
HABA, BELGACEM
Executed: 2011-12-23
ZOHNI, WAEL
Executed: 2012-01-13
CRISP, RICHARD DEWITT
Executed: 2012-01-13
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Enhanced Stacked Microelectronic Assemblies with Central Contacts and Improved Ground or Power Distribution
Patent: 8,885,356 →
Application: 13/278,514 →
Publication: US 2012/0155042
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →