Patent Assignment
Reel/Frame 027703/0978
Assignment of Assignor's Interest
Recorded: 2012-02-14
Pages: 2
Assignor
HSIAO, WEI-MIN
Executed: 2012-02-06
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Carrier Bonding and Detaching Processes for a Semiconductor Wafer