Patent Assignment
Reel/Frame 027704/0196
Assignment of Assignor's Interest
Recorded: 2012-02-14
Pages: 4
Assignors
XUE, YAN XUN
Executed: 2012-02-13
HUANG, PING
Executed: 2012-02-14
HO, YUEH-SE
Executed: 2012-02-13
Assignee
ALPHA AND OMEGA SEMICONDUCTOR, INCORPORATED
475 OAKMEAD PKWY, SUNNYVALE, CALIFORNIA, 94085
Covered Property
(1)
Packaging Method with Backside Wafer Dicing