Patent Assignment
Reel/Frame 027705/0648
Assignment of Assignor's Interest
Recorded: 2012-02-15
Pages: 4
Assignors
MII, TATSUNARI
Executed: 2012-02-06
TEI, SHINSUKE
Executed: 2012-02-09
KIUCHI, HAYATO
Executed: 2012-02-04
Assignee
SHINKAWA LTD.
2-51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Wire Bonding Method and Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.