Patent Assignment
Reel/Frame 027729/0093
Assignment of Assignor's Interest
Recorded: 2012-02-18
Pages: 4
Assignors
KWON, HEUNG-KYU
Executed: 2012-01-25
SHIN, SEONG-HO
Executed: 2012-01-19
CHOI, YUN-SEOK
Executed: 2012-01-19
KIM, YONG-HOON
Executed: 2012-01-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI,, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices, Package Substrates, Semiconductor Packages, Package Stack Structures, and Electronic Systems Having Functionally Asymmetric Conductive Elements