Patent Assignment
Reel/Frame 027730/0032
Assignment of Assignor's Interest
Recorded: 2012-02-20
Pages: 2
Assignor
WU, JIUN YI
Executed: 2012-01-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Methods and Apparatus for Thinner Package on Package Structures
Application:
13/350,499 →
Publication:
US 2013/0181359