Patent Assignment
Reel/Frame 027738/0202
Assignment of Assignor's Interest
Recorded: 2012-02-21
Pages: 2
Assignors
LIN, JING-CHENG
Executed: 2012-02-14
CHANG, HSIN
Executed: 2012-02-14
LIN, SHIH TING
Executed: 2012-02-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Chip-On-Wafer Structures and Methods for Forming the Same