Patent Assignment
Reel/Frame 027745/0660
Assignment of Assignor's Interest
Recorded: 2012-02-22
Pages: 6
Assignors
OH, HUENG JAE
Executed: 2012-01-30
JUNG, BOO YANG
Executed: 2012-01-30
LEE, DAE YOUNG
Executed: 2012-01-30
CHOI, JIN WON
Executed: 2012-01-30
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board and Method for Manufacturing the Same