Patent Assignment
Reel/Frame 027760/0722
Assignment of Assignor's Interest
Recorded: 2012-02-24
Pages: 3
Assignor
CHO, MIN GI
Executed: 2012-02-09
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON,, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof