Patent Assignment
Reel/Frame 027767/0351
Assignment of Assignor's Interest
Recorded: 2012-02-27
Pages: 4
Assignors
CHANG, I-MING
Executed: 2012-02-21
GUO, WEN-HUEI
Executed: 2012-02-22
CHANG, CHIH-HAO
Executed: 2012-02-22
CHANG, SHOU-ZEN
Executed: 2012-02-23
WANN, CLEMENT HSINGJEN
Executed: 2012-02-23
LEE, TUNG YING
Executed: 2012-02-21
HUANG, JUI-CHIEN
Executed: 2012-02-22
CHEN, CHENG-LONG
Executed: 2012-02-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Curved Wafer Processing on Method and Apparatus