Patent Assignment
Reel/Frame 027794/0675
Assignment of Assignor's Interest
Recorded: 2012-03-02
Pages: 2
Assignor
HOSHINO, YUTAKA
Executed: 2011-12-15
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Manufacturing Method of Semiconductor Device Having Semiconductor Layers with Different Thicknesses
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.