Patent Assignment
Reel/Frame 027810/0737
Assignment of Assignor's Interest
Recorded: 2012-03-06
Pages: 3
Assignor
RATHBURN, JAMES
Executed: 2012-03-01
Assignee
HSIO TECHNOLOGIES LLC
13300 67TH AVENUE NORTH, MAPLE GROVE, MINNESOTA, 55311
Covered Property
(1)
Area Array Semiconductor Device Package Interconnect Structure with Optional Package-to-Package or Flexible Circuit to Package Connection
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Serial Number and Filing Date on the Face of the Assignment Previously Recorded on Reel 027810 Frame 0737. Assignor(S) Hereby Confirms the Assignment from James Rathburn to Hsio Technologies, Llc..
Mar 13, 2012
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027855/0781 →
Assignment of Assignor's Interest
Oct 30, 2023
From: HSIO TECHNOLOGIES, LLC
To: LCP MEDICAL TECHNOLOGIES, LLC
Reel/Frame 065391/0193 →