IP Library Assignment 065391/0193
Patent Assignment
Reel/Frame 065391/0193

Assignment of Assignor's Interest

Recorded: 2023-10-30 Pages: 7
Assignor
HSIO TECHNOLOGIES, LLC
Executed: 2023-08-21
Assignee
LCP MEDICAL TECHNOLOGIES, LLC
11795 TILTON TRAIL N., ROGERS, MINNESOTA, 55374
Covered Properties (28)
High Performance Surface Mount Electrical Interconnect
Patent: 8,955,215 →
Application: 13/266,486 →
Publication: US 2012/0055701
Compliant Wafer Level Probe Assembly
Patent: 8,803,539 →
Application: 13/266,522 →
Publication: US 2012/0068727
Compliant Printed Circuit Area Array Semiconductor Device Package
Patent: 9,054,097 →
Application: 13/266,573 →
Publication: US 2012/0061846
Method of Making a Compliant Printed Circuit Peripheral Lead Semiconductor Test Socket
Patent: 8,789,272 →
Application: 13/318,171 →
Publication: US 2012/0049877
Compliant Printed Circuit Wafer Level Semiconductor Package
Patent: 9,136,196 →
Application: 13/318,200 →
Publication: US 2012/0056332
Composite Polymer-Metal Electrical Contacts
Patent: 9,277,654 →
Application: 13/318,369 →
Publication: US 2012/0043119
Resilient Conductive Electrical Interconnect
Patent: 9,231,328 →
Application: 13/318,382 →
Publication: US 2012/0043130
Method of Forming a Semiconductor Socket
Patent: 9,320,144 →
Application: 13/319,158 →
Publication: US 2012/0051016
Singulated Semiconductor Device Separable Electrical Interconnect
Patent: 8,984,748 →
Application: 13/319,228 →
Publication: US 2012/0058653
Compliant Printed Flexible Circuit
Patent: 9,414,500 →
Application: 13/320,285 →
Publication: US 2012/0055702
Metalized Pad to Electrical Contact Interface
Patent: 9,276,336 →
Application: 13/410,914 →
Publication: US 2012/0164888
Area Array Semiconductor Device Package Interconnect Structure with Optional Package-to-Package or Flexible Circuit to Package Connection
Patent: 9,613,841 →
Application: 13/410,943 →
Publication: US 2012/0161317
Selective Metalization of Electrical Connector or Socket Housing
Patent: 8,758,067 →
Application: 13/412,870 →
Publication: US 2012/0171907
Semiconductor Device Package Adapter
Patent: 9,184,145 →
Application: 13/643,436 →
Publication: US 2013/0105984
Electrical Connector Insulator Housing
Patent: 9,184,527 →
Application: 13/700,639 →
Publication: US 2013/0078860
Electrical Interconnect Ic Device Socket
Patent: 9,276,339 →
Application: 13/880,231 →
Publication: US 2013/0210276
Electrical Interconnect Ic Device Socket
Patent: 9,320,133 →
Application: 13/880,461 →
Publication: US 2013/0206468
Compliant Core Peripheral Lead Semiconductor Socket
Patent: 8,829,671 →
Application: 14/058,863 →
Publication: US 2014/0043782
Compliant Printed Circuit Semiconductor Package
Patent: 9,076,884 →
Application: 14/086,029 →
Publication: US 2014/0080258
Method of Making an Electronic Interconnect
Patent: 9,318,862 →
Application: 14/254,038 →
Publication: US 2014/0220797
High Speed Circuit Assembly with Integral Terminal and Mating Bias Loading Electrical Connector Assembly
Patent: 9,350,124 →
Application: 14/408,039 →
Publication: US 2015/0136467
Semiconductor Socket with Direct Selective Metalization
Patent: 9,536,815 →
Application: 14/408,338 →
Publication: US 2015/0279768
Performance Enhanced Semiconductor Socket
Patent: 9,689,897 →
Application: 14/565,724 →
Publication: US 2015/0091600
High Performance Surface Mount Electrical Interconnect
Patent: 9,660,368 →
Application: 14/621,663 →
Publication: US 2015/0162678
Mechanical Contact Retention Within an Electrical Connector
Patent: 9,559,447 →
Application: 15/062,136 →
Publication: US 2016/0276762
Method of Making an Electrical Connector Having Electrodeposited Terminals
Patent: 9,761,520 →
Application: 15/062,137 →
Publication: US 2016/0192507
Low Profile Electrical Interconnect with Fusion Bonded Contact Retention and Solder Wick Reduction
Patent: 9,755,335 →
Application: 15/062,138 →
Publication: US 2016/0276763
Electrodeposited Contact Terminal for Use as an Electrical Connector or Semiconductor Packaging Substrate
Application: 15/698,271 →
Publication: US 2018/0012832
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 27, 2011
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, INC.
Reel/Frame 027132/0509 →
Assignment of Assignor's Interest Oct 27, 2011
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027130/0879 →
Assignment of Assignor's Interest Oct 27, 2011
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027131/0203 →
Assignment of Assignor's Interest Oct 31, 2011
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027147/0923 →
Assignment of Assignor's Interest Oct 31, 2011
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027146/0727 →
Assignment of Assignor's Interest Nov 1, 2011
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027152/0249 →
Assignment of Assignor's Interest Nov 1, 2011
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027153/0022 →
Assignment of Assignor's Interest Nov 7, 2011
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027185/0752 →
Assignment of Assignor's Interest Nov 7, 2011
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027184/0194 →
Assignment of Assignor's Interest Nov 14, 2011
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027219/0257 →
Assignment of Assignor's Interest Mar 6, 2012
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES LLC
Reel/Frame 027810/0737 →
Assignment of Assignor's Interest Mar 6, 2012
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027811/0686 →
Assignment of Assignor's Interest Mar 6, 2012
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027810/0634 →
Corrective Assignment to Correct the Serial Number and Filing Date on the Face of the Assignment Previously Recorded on Reel 027810 Frame 0737. Assignor(S) Hereby Confirms the Assignment from James Rathburn to Hsio Technologies, Llc.. Mar 13, 2012
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027855/0781 →
Corrective Assignment to Correct the Serial Number and Filing Date on the Face of the Assignment Previously Recorded on Reel 027810 Frame 0634. Assignor(S) Hereby Confirms the Assignment from James Rathburn to Hsio Technologies, Llc. Mar 13, 2012
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 027854/0796 →
Assignment of Assignor's Interest Nov 28, 2012
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 029366/0898 →
Assignment of Assignor's Interest Dec 6, 2012
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 029417/0391 →
Assignment of Assignor's Interest Apr 18, 2013
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 030244/0082 →
Assignment of Assignor's Interest Apr 19, 2013
From: RATHBURN, JAMES
To: HSIO TECHNOLOGIES, LLC
Reel/Frame 030251/0757 →