Semiconductor device package adapter
A semiconductor device packaged adapter for electrically coupling contacts on a first circuit member to contacts on a second circuit member. The adapter typically includes first and second substrates, each with arrays of terminals. Proximal ends of the first terminals on the first substrate are arranged to be soldered to the contacts on the first circuit member and proximal ends of the second terminals on the second substrate are arranged to be soldered to the contacts on the second circuit member. Complementary engaging structures located on distal ends of the first and second terminals engage to electrically and mechanically couple the first circuit member to the second circuit member.
1. A semiconductor device packaged adapter to electrically couple contacts on a first circuit member to contacts on a second circuit member, the adapter comprising:
a first substrate comprising a plurality of first terminals, proximal ends of the first terminals arranged to be soldered to the contacts on the first circuit member;
a second substrate comprising a plurality of second terminals, proximal ends of the second terminals arranged to be soldered to the contacts on the second circuit member; and
complementary inter-engaging structures located on distal ends of the first and second terminals that engage in a high surface area, multi-point electrical connection to electrically and mechanically couple the first circuit member to the second circuit member.
2. The adapter of claim 1 comprising recesses in the first substrate at proximal ends of the first terminals.
3. The adapter of claim 2 wherein the recesses are sized to receive solder balls on the first circuit member.
4. The adapter of claim 1 comprising recesses in the second substrate at proximal ends of the second terminals, the recesses sized to receive solder balls.
5. The adapter of claim 1 wherein the engaging structures on the second terminals extend above the second substrate.
6. The adapter of claim 1 comprising one or more layers on at least one of the first and second substrates, the layers comprising one of a ground plane, a power plane, or shielding.
7. The adapter of claim 1 comprising electrical shielding covered by a dielectric material surrounding at least the first terminals.
8. The adapter of claim 1 comprising electrical devices in one or more of the first and second substrates.
9. The adapter of claim 1 comprising at least one electrical device printed on the first or second substrate and electrically coupled to at least one terminal.
10. The adapter of claim 1 comprising routing traces on one or more of the first and second substrates, the routing traces changing a pitch between the proximal ends and distal ends of the terminals.
11. The adapter of claim 10 wherein routing traces comprise a conductive material printed in recesses in the first and second substrates.
12. The adapter of claim 1 wherein distal ends of the first terminals comprise at least one flexible beam configured to flex in response to engagement with distal ends of the second terminals.
13. The adapter of claim 1 comprising:
guide features on the first substrate located near distal ends of the first terminals; and
recesses on the second substrate locate near distal ends of the second terminals and configured to receive the guide features.
14. A method of electrically coupling contacts on a first circuit member to contacts on a second circuit member, the method comprising the steps of:
soldering proximal ends of first terminals on a first substrate to the contacts on the first circuit member;
soldering proximal ends of second terminals on a second substrate to the contacts on the first circuit member; and
engaging complementary inter-engaging structures located at distal ends of the first and second terminals in a high surface area, multi-point electrical connection to electrically and mechanically couple the first circuit member to the second circuit member.
15. The method of claim 14 comprising locating solder balls on the first circuit member in recesses in the first substrate at proximal ends of the first terminals.
16. The method of claim 14 comprising depositing one or more of a ground plane, a power plane, or shielding on at least one of the first and second substrates.
17. The method of claim 14 comprising locating electrical shielding covered by a dielectric material around at least the first terminals.
18. The method of claim 14 comprising printing electrical devices on one or more of the first and second substrates.
19. The method of claim 14 comprising changing a pitch between the proximal ends and distal ends, of the terminals on one or more of the first and second substrates.
20. The method of claim 14 comprising printing a conductive material in recesses in the first and second substrates to form the engaging structures on the distal ends.
21. The method of claim 14 comprising flexing distal ends of the first terminals in response to engagement with distal ends of the second terminals.
22. The method of claim 14 wherein the circuit members are selected from one of a dielectric layer, a printed circuit board, a flexible circuit, a bare die device, an integrated circuit device, organic or inorganic substrates, or a rigid circuit.