Patent Assignment
Reel/Frame 027812/0865
Assignment of Assignor's Interest
Recorded: 2012-03-06
Pages: 2
Assignors
TSENG, TZYY-JANG
Executed: 2011-10-07
HU, DYI-CHUNG
Executed: 2011-10-07
HU, YU-SHAN
Executed: 2011-10-07
Assignee
UNIMICRON TECHNOLOGY CORPORATION
NO. 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property
(1)
Package Structure, Fabricating Method Thereof, and Package-on-Package Device Thereby