Patent Assignment
Reel/Frame 027818/0178
Assignment of Assignor's Interest
Recorded: 2012-03-07
Pages: 4
Assignor
IWATSU, HARUO
Executed: 2012-03-05
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU,, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device